Laser Micro-Perforated Plates – Largest Opening Rates for Precision Filtering Solutions

Our laser micro-perforated plates utilize high-precision laser processing to create apertures as small as 10 microns (0.01 mm) on metal sheets or tubes, effectively handling tough materials without tool wear.

Our laser-cut micro-perforated plates use advanced high-performance laser cutting/drilling equipment with minimal thermal deformation, fast processing speed, high efficiency, small straight-edge cutting, smooth cutting surface, no mechanical deformation, and large depth-to-diameter ratio and depth-to-width.

This allows for laser micro perforation in thicker plates, ultra-high opening rates, and precise mesh holes, making it an indispensable solution in high-end manufacturing.

We also offer comprehensive processing services, including electrolytic polishing, vacuum cleaning, rolling, forming, and welding to meet diverse industry needs.

Tens of thousands of holes on a circular laser micro-perforated plate

Drawing pattern before drilling

The completed laser micro-perforated plate details

Laser perforation details

Processing equipment with gears

Laser micro-perforated tube

Technical Parameters

Table 1: Specifications of Laser Micro-Perforated Plates
Parameter	Numerical range
Hole size	Large hole: > 3.00 mm
	Small hole: 1.00–3.00 mm
	Micro pores: 0.20–1.00 mm
	Middle micro pores: 0.10–0. 20 mm
	Ultra micro pores: 0.01–0.10 mm
	Circle, slots, square are available for holes above sizes.
Mesh holes accuracy (Repeat positioning accuracy)	Aperture tolerance ±0.005 mm.
	The hole spacing accuracy is ±0.01 mm, which is suitable for precision filtration, flow equalization and heat dissipation applications.
	Ensure hole position consistency.
Punching depth (Material Thickness)	< 5.0 mm (depending on the material and hole), easy to punch tubes and plates.
Main material	Stainless steel, alloy steel, aluminum and alloys, copper and alloys, titanium and alloys, nickel-molybdenum alloys, etc.
Pore density	10–10000 pores/cm², air permeability controllable (0.1–100 L/min·cm²)
Surface roughness	Ra 0.4–1.6 μm (no burrs) directly used in optical or sealing scenes
Processing speed	100–500 holes/minute (depending on hole size and complexity), supporting 24-hour continuous production

Perforation Processing Comparison

There are more micro-hole processing methods, conventional laser drilling, drill drilling, CNC punching, etching and perforation, the following are four kinds of perforation processing metal microplate industrial comparison. Specific process selection, we will recommend the best solution for you according to the specific specifications, quantity, price budget and quality requirements.

Table 2: Perforation Processing Comparison
Comparison Dimensions	Laser Drilling	Bits Drilling	CNC Punching	Etching
Processing principle	High-energy laser beam ablation of materials	Mechanical cutting (rotary drill)	Die stamping	Selective corrosion by chemical solution
Micropore diameter range	0.02–1 mm	0.6–1 mm (Carbide drill bit)	0.3–1 mm (limited by mold)	0.05–1 mm
Processing accuracy	±0.005 mm	±0.02–0.05 mm	±0.1 mm (Influence of mold wear)	±0.01–0.03 mm
Material adaptability	Metals, ceramics, plastics, composite materials	Metal, wood, plastic (hardness ≤ HRC 60)	Normal Sheet Metal (≤ 6 mm) heavy duty	Metal foil (≤ 0.5 mm), silicon wafer, glass (mask required)
Processing speed	100–500 hole/Minutes (depending on aperture complexity)	10–50 hole/Minutes (manual) 50–200 hole/minute (CNC multi-axis)	300–1000 holes/minute (batch)	1–10 minutes/sheet (whole sheet etching)
Advantages	High-precision micro-hole non-contact processing No mechanical stress Can process special-shaped holes	Suitable for thick plate processing holes much smaller than the thickness. High flexibility.	Low cost in large batches quantity. High processing efficiency. Good hole consistency.	Ultra-fine hole processing complex graphics one-step molding.
Shortcomings	High equipment investment Low efficiency of deep holes (hole depth > 5 mm) Laser thermal impact (nitrogen protection is required to prevent oxidation when processing stainless steel)	The hole wall roughness is high (Ra 3.2–6.3 μm) The drill bit is easy to wear and the thin plate is easy to deform. Drilling and chip removal: Deep hole processing requires internal cooling drill (to avoid chip blockage)	High mold cost when quantity is small. The aperture is not adjustable and the die is worn out. The hole has errors (control method: regular inspection of punch clearance, burr prevention and tolerance reduction). Material thickness restrictions.	Only suitable for thin materials (≤ 0.5 mm) Chemical waste liquid treatment is difficult (waste liquid neutralization treatment equipment is required) Limited material types.
Typical application	Air film holes of aviation turbine blades, micro vias for electronic devices	Hydraulic pulper screens, rotary grinding screens for paper making, sugar making, fish meal industry	Screening, filtering strainers, architectural decoration panels	IC lead frame diffraction holes for optical devices, electronic component
Selection suggestions	High-precision micro-holes: laser or etching is preferred (aperture < 0.3 mm)	Thick plate processing (> 5 mm): Select drill bit to drill holes	Standardized holes in large quantities: CNC punching machines	Complex graphics/Ultra-thin materials: chemical etching (with photolithography mask)

Applications

Laser micro perforation achieve super micropores in thicker plates, ultra-high opening rates, irreplaceable solution for high-end applications.

Aerospace: Film cooling hole plate for engine combustion chamber, high temperature resistance (above 1000 °C), equalizing pressure and cooling.
Medical Devices: Hemodialysis filter, drug-controlled release membrane, Biocompatibility, precise pore size distribution.
New Energy: Hydrogen fuel cell bipolar plate flow channel, gas diffusion uniformity improves power generation efficiency.
Electronic cooling: 5G base station heat dissipation plate, micro pore array enhances thermal convection (lower thermal resistance) 30%.
Environmental filtration: Industrial waste gas PM2.5 metal filter, interception efficiency> 99.9%, can be washed repeatedly.

Cases Display

Through client cases, you can learn our excellent product quality and process in-depth, and feel the quality of our laser cutting super micros perforated plates.

Microporous perforated plate above a return clip are placed on the table

0.1 mm Laser Micro-Perforation Plate

0.6 mm thick laser cutting perforated metal ring

0.15 mm Laser Cutting Perforated Metal Ring

The hole of the laser micro-perforation plate is measured to be 0.3 mm.

0.3 mm Laser Micro-Perforation Plate

0.6 mm Laser Drilling Perforated Metal Cylinder

Laser Drilling Micro Perforated Disc

Laser Square Perforated Plate

Quality ControlRead more

QIUSUO is committed to delivering Laser cutting super micros perforated plates of superior quality. Our stringent quality control process ensures that you receive a reliable product that meets the highest standards.

Contact Us

If you need to consult the price, please contact the business department by E-mail: sales@qs-wiremesh.com

When you contact us, please provide your detail requirements. That will help us give you a valid quotation.

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